SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea
11. September 2025SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies. The facility, provisionally named “P&T 7,” will be located in Cheongju, North Chungcheong Province. The company has begun demolishing a former LG plant it had previously acquired on the site, with plans to complete the demolition by September. Machines and products involved in chip production usually require KCs certification in order to be approved for import and sale in Korea.
While a construction timeline for the seventh facility has yet to be finalized, the site is expected to function both as a packaging plant for finished products and as a testing fab. SK hynix currently operates six backend (P&T) buildings across Icheon and Cheongju. The backend process, which includes wafer dicing, chip testing, and packaging, is becoming increasingly vital as traditional semiconductor scaling approaches its physical limits. In this context, advanced packaging technologies are emerging as a critical pathway to achieving improved performance and power efficiency in next-generation chips.
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