{"id":24659,"date":"2025-09-11T18:38:16","date_gmt":"2025-09-11T16:38:16","guid":{"rendered":"https:\/\/www.korea-certification.com\/?p=24659"},"modified":"2025-09-11T18:38:27","modified_gmt":"2025-09-11T16:38:27","slug":"sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea","status":"publish","type":"post","link":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/","title":{"rendered":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea"},"content":{"rendered":"\n

SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies. The facility, provisionally named \u201cP&T 7,\u201d will be located in Cheongju, North Chungcheong Province. The company has begun demolishing a former LG plant it had previously acquired on the site, with plans to complete the demolition by September. Machines and products involved in chip production usually require KCs certification<\/strong><\/a> in order to be approved for import and sale in Korea.<\/p>\n\n\n\n

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While a construction timeline for the seventh facility has yet to be finalized, the site is expected to function both as a packaging plant for finished products and as a testing fab. SK hynix currently operates six backend (P&T) buildings across Icheon and Cheongju. The backend process, which includes wafer dicing, chip testing, and packaging, is becoming increasingly vital as traditional semiconductor scaling approaches its physical limits. In this context, advanced packaging technologies are emerging as a critical pathway to achieving improved performance and power efficiency in next-generation chips.<\/p>\n\n\n\n

Feel free to contact us any time if you need assistance or have any questions regarding Korean certifications like KC<\/strong><\/a>, KC EMC<\/strong><\/a>, KCs<\/strong><\/a>, KCs for explosion safety products<\/strong><\/a> or KGS factory registration<\/strong><\/a>.<\/p>\n\n\n\n

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Email: info@korea-certification.com<\/strong><\/a><\/strong><\/p>\n\n\n\n

For more information you can download our free brochure “Korea Certification Made Easy – The Booklet<\/strong><\/a>“.<\/p>\n","protected":false},"excerpt":{"rendered":"

SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies. The facility, provisionally named \u201cP&T 7,\u201d will be located in Cheongju, North Chungcheong Province. The company has begun demolishing a former LG plant it had […]<\/p>\n","protected":false},"author":8,"featured_media":24031,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"categories":[106],"tags":[],"class_list":["post-24659","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-further-topics"],"acf":[],"yoast_head":"\nSK hynix expands Chip Packaging Capacity with new Backend Facility in Korea<\/title>\n<meta name=\"description\" content=\"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea\" \/>\n<meta property=\"og:description\" content=\"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/\" \/>\n<meta property=\"og:site_name\" content=\"MPR Korea Certification\" \/>\n<meta property=\"article:published_time\" content=\"2025-09-11T16:38:16+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-09-11T16:38:27+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png\" \/>\n\t<meta property=\"og:image:width\" content=\"614\" \/>\n\t<meta property=\"og:image:height\" content=\"460\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Louis Gogger\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Louis Gogger\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/\"},\"author\":{\"name\":\"Louis Gogger\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/#\\\/schema\\\/person\\\/a012d056be3e28c589b5f1b96a64bf20\"},\"headline\":\"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea\",\"datePublished\":\"2025-09-11T16:38:16+00:00\",\"dateModified\":\"2025-09-11T16:38:27+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/\"},\"wordCount\":253,\"image\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Semiconductor-1-2.png\",\"articleSection\":[\"Further Topics\"],\"inLanguage\":\"en-US\",\"copyrightYear\":\"2025\",\"copyrightHolder\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/#organization\"}},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/\",\"url\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/\",\"name\":\"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Semiconductor-1-2.png\",\"datePublished\":\"2025-09-11T16:38:16+00:00\",\"dateModified\":\"2025-09-11T16:38:27+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/#\\\/schema\\\/person\\\/a012d056be3e28c589b5f1b96a64bf20\"},\"description\":\"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Semiconductor-1-2.png\",\"contentUrl\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Semiconductor-1-2.png\",\"width\":614,\"height\":460},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/#website\",\"url\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/\",\"name\":\"MPR Korea Certification\",\"description\":\"Ihr Experte f\u00fcr Korea-Zertifizierungen\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/#\\\/schema\\\/person\\\/a012d056be3e28c589b5f1b96a64bf20\",\"name\":\"Louis Gogger\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Louis_Gogger-4-3-2-1-150x150.jpg\",\"url\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Louis_Gogger-4-3-2-1-150x150.jpg\",\"contentUrl\":\"https:\\\/\\\/www.korea-certification.com\\\/wp-content\\\/uploads\\\/Louis_Gogger-4-3-2-1-150x150.jpg\",\"caption\":\"Louis Gogger\"},\"description\":\"About the author: Louis Gogger is Managing Director of MPR International GmbH Publisher: MPR International GmbH Tel.: +49 69 271 37 69 259 E-Mail: info@korea-certification.com Web: www.korea-certification.com\",\"url\":\"https:\\\/\\\/www.korea-certification.com\\\/en\\\/author\\\/louis-gogger\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea","description":"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/","og_locale":"en_US","og_type":"article","og_title":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea","og_description":"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.","og_url":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/","og_site_name":"MPR Korea Certification","article_published_time":"2025-09-11T16:38:16+00:00","article_modified_time":"2025-09-11T16:38:27+00:00","og_image":[{"width":614,"height":460,"url":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png","type":"image\/png"}],"author":"Louis Gogger","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Louis Gogger","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#article","isPartOf":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/"},"author":{"name":"Louis Gogger","@id":"https:\/\/www.korea-certification.com\/en\/#\/schema\/person\/a012d056be3e28c589b5f1b96a64bf20"},"headline":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea","datePublished":"2025-09-11T16:38:16+00:00","dateModified":"2025-09-11T16:38:27+00:00","mainEntityOfPage":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/"},"wordCount":253,"image":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#primaryimage"},"thumbnailUrl":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png","articleSection":["Further Topics"],"inLanguage":"en-US","copyrightYear":"2025","copyrightHolder":{"@id":"https:\/\/www.korea-certification.com\/#organization"}},{"@type":"WebPage","@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/","url":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/","name":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea","isPartOf":{"@id":"https:\/\/www.korea-certification.com\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#primaryimage"},"image":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#primaryimage"},"thumbnailUrl":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png","datePublished":"2025-09-11T16:38:16+00:00","dateModified":"2025-09-11T16:38:27+00:00","author":{"@id":"https:\/\/www.korea-certification.com\/en\/#\/schema\/person\/a012d056be3e28c589b5f1b96a64bf20"},"description":"SK hynix, a global leader in memory chip manufacturing, is preparing to build a new backend production facility to enhance its packaging capabilities amid growing demand for advanced semiconductor technologies.","breadcrumb":{"@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#primaryimage","url":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png","contentUrl":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Semiconductor-1-2.png","width":614,"height":460},{"@type":"BreadcrumbList","@id":"https:\/\/www.korea-certification.com\/en\/sk-hynix-expands-chip-packaging-capacity-with-new-backend-facility-in-korea\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.korea-certification.com\/en\/"},{"@type":"ListItem","position":2,"name":"SK hynix expands Chip Packaging Capacity with new Backend Facility in Korea"}]},{"@type":"WebSite","@id":"https:\/\/www.korea-certification.com\/en\/#website","url":"https:\/\/www.korea-certification.com\/en\/","name":"MPR Korea Certification","description":"Ihr Experte f\u00fcr Korea-Zertifizierungen","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.korea-certification.com\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.korea-certification.com\/en\/#\/schema\/person\/a012d056be3e28c589b5f1b96a64bf20","name":"Louis Gogger","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Louis_Gogger-4-3-2-1-150x150.jpg","url":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Louis_Gogger-4-3-2-1-150x150.jpg","contentUrl":"https:\/\/www.korea-certification.com\/wp-content\/uploads\/Louis_Gogger-4-3-2-1-150x150.jpg","caption":"Louis Gogger"},"description":"About the author: Louis Gogger is Managing Director of MPR International GmbH Publisher: MPR International GmbH Tel.: +49 69 271 37 69 259 E-Mail: info@korea-certification.com Web: www.korea-certification.com","url":"https:\/\/www.korea-certification.com\/en\/author\/louis-gogger\/"}]}},"_links":{"self":[{"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/posts\/24659","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/comments?post=24659"}],"version-history":[{"count":1,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/posts\/24659\/revisions"}],"predecessor-version":[{"id":24661,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/posts\/24659\/revisions\/24661"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/media\/24031"}],"wp:attachment":[{"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/media?parent=24659"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/categories?post=24659"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.korea-certification.com\/en\/wp-json\/wp\/v2\/tags?post=24659"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}